Interface dynamics for copper electrodeposition: The role of organic additives in the growth mode

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An atomistic model for Cu electrodeposition under nonequilibrium conditions is presented. Cu electrodeposition takes place with a height-dependent deposition rate that accounts for fluctuations in the local [formula presented] ions concentration at the interface, followed by surface...

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Detalles Bibliográficos
Autores principales: De Leon, P.F.J., Albano, E.V., Salvarezza, R.C., Solari, H.G.
Formato: Artículo publishedVersion
Publicado: 2002
Materias:
Additives
Chemical vapor deposition
Computer simulation
Copper
Diffusion
Electrodeposition
Interfaces (materials)
Ions
Mass transfer
Mathematical models
Monolayers
Probability
Surface roughness
Atomistic model
Edwards-Wilkinson equation
Energy barriers
Growth dynamics
Surface chemistry
article
Acceso en línea:http://hdl.handle.net/20.500.12110/paper_1063651X_v66_n4_p4_DeLeon
https://repositoriouba.sisbi.uba.ar/gsdl/cgi-bin/library.cgi?a=d&c=artiaex&d=paper_1063651X_v66_n4_p4_DeLeon_oai
Aporte de:
Repositorio Digital de la Universidad de Buenos Aires (UBA) de Universidad de Buenos Aires

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